1 copyright ? 2010, everlight all rights reserved. release date : mar.13. 2014. issue no: dle-0006644_rev.1 www.everlight.com lamp 333-2subw/c470/s400-a4 features ? choice of various viewing angles ? available on tape and reel. ? reliable and robust ? pb free ? the product itself will remain within rohs compliant version. ? compliance with eu reach ? compliance halogen free .(br <900 ppm ,cl <900 ppm , br+cl < 1500 ppm) description ?the series is specially designed for app lications requiring higher brightness ?the led lamps are available with different colors, intensities.. a pplications ? tv set ? monitor ? telephone ? computer
datasheet lamp 333-2subw/c470/s400-a4 2 copyright ? 2010, everlight all rights reserved. release date : mar.13. 2014. issue no: dle-0006644_rev.1 www.everlight.com device selection guide chip materials emitted color resin color ingan blue white diffused a bsolute maximum ratings (ta=25 ) parameter symbol rating unit continuous forward current i f 25 ma peak forward current (duty 1/10 @ 1khz) i fp 100 ma reverse voltage v r 5 v power dissipation p d 90 mw operating temperature t opr -40 ~ +85 storage temperature tstg -40 ~ +100 soldering temperature t sol 260 for 5 sec. electro-optical ch aracteristics (ta=25 ) parameter symbol min. typ. max. unit condition luminous intensity iv 100 200 ----- mcd i f =20ma viewing angle 2 1/2 ----- 40 ----- deg i f =20ma peak wavelength p ----- 468 ----- nm i f =20ma dominant wavelength d ----- 470 ----- nm i f =20ma spectrum radiation bandwidth ? ----- 20 ----- nm i f =20ma forward voltage v f 2.7 3.3 3.7 v i f =20ma reverse current i r ----- ----- 50 a v r =5v
datasheet lamp 333-2subw/c470/s400-a4 3 copyright ? 2010, everlight all rights reserved. release date : mar.13. 2014. issue no: dle-0006644_rev.1 www.everlight.com typical electro-optical characteristics curves relative intensity vs. wavelength (ta=25 ) directivity (ta=25 ) relative intensity (a.u.) radiation angle wavelength (nm) relative intensity (a.u.) forward current vs. forward voltage (ta=25 ) relative intensity vs. forward current (ta=25 ) forward current (ma) 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0 5 10 15 20 25 relative intensity(a.u.) 0 5 10 15 20 25 0.0 0.5 1.0 1.5 forward voltage (v) forward current (ma) relative intensity vs. ambient temp. forward current vs. ambient temp. relative intensity(a.u.) 25 30 35 40 45 50 55 60 65 70 0.0 0.5 1.0 1.5 2.0 forward current (ma) 0 20406080100 0 10 20 30 40 ambient temperature ta () ambient temperature ta ()
datasheet lamp 333-2subw/c470/s400-a4 4 copyright ? 2010, everlight all rights reserved. release date : mar.13. 2014. issue no: dle-0006644_rev.1 www.everlight.com package dimension note: note: 1. all dimensions are in millimeters 2. the height of flange must be less than 1.5mm(0.059"). 3. without special declared, the tolerance is 0.25mm.
datasheet lamp 333-2subw/c470/s400-a4 5 copyright ? 2010, everlight all rights reserved. release date : mar.13. 2014. issue no: dle-0006644_rev.1 www.everlight.com pb el ectrostatic electronagnetic magnetic or radioactive relds anti-static for 750 moisture resistant packing materials label explanation cpn: customer's production number p/n : production number qty: packing quantity cat: ranks hue: dominant wavelength ref: forward voltage lot no: lot number packing specification anti-electrostatic bag inner carton outside carton notes rohs pb x everlight 333-2subw/c470/s400-a4 packing quantity 1.500 pcs/1 bag, 5 bags/1 inner carton 2. 10 inner cartons/1 outside carton
datasheet lamp 333-2subw/c470/s400-a4 6 copyright ? 2010, everlight all rights reserved. release date : mar.13. 2014. issue no: dle-0006644_rev.1 www.everlight.com prehead laminar wave fluxing 1. lead forming ? during lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb. ? lead forming should be done before soldering. ? avoid stressing the led package during leads forming. the st ress to the base may damage the led?s characteristics or it may break the leds. ? cut the led lead frames at room temperat ure. cutting the lead frames at high tem peratures may cause failure of the leds. ? when mounting the leds onto a pc b, the pcb holes must be aligned exactly with the lead position of t he led. if the leds are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the leds. 2. storage ? the leds should be stored at 30c or less and 70%rh or less af ter being shipped from everlight and the storage life limits are 3 months. if the leds are stored for 3 months or more, they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material. ? please avoid rapid transitions in ambi ent temperature, especially, in high hum idity environments where condensation can occur. 3. soldering ? careful attention should be paid during soldering. when solder ing, leave more then 3mm from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is recommended. ? recommended soldering conditions: hand soldering dip soldering temp. at tip of iron 300 max. (30w max.) preheat temp. 100 max. (60 sec max.) soldering time 3 sec max. bath temp. & time 260 max., 5 sec max distance 3mm min.(from solder joint to epoxy bulb) distance 3mm min. (from solder joint to epoxy bulb) ? recommended soldering profile ? avoiding applying any stress to the lead frame while the le ds are at high temperature pa rticularly when soldering. ? dip and hand soldering should not be done more than one time ? after soldering the leds, the epoxy bulb should be protected fr om mechanical shock or vibration until the leds return to room temperature. ? a rapid-rate process is not recommended for cool ing the leds down from the peak temperature. ? although the recommended soldering conditions are specified in the above table, dip or ha nd soldering at the lowest
datasheet lamp 333-2subw/c470/s400-a4 7 copyright ? 2010, everlight all rights reserved. release date : mar.13. 2014. issue no: dle-0006644_rev.1 www.everlight.com possible temperature is desirable for the leds. ? wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. 4. cleaning ? when necessary, cleaning should occur only with isopropyl al cohol at room temperature fo r a duration of no more than one minute. dry at room te mperature before use. ? do not clean the leds by the ultrasonic. when it is absolutel y necessary, the influence of ultrasonic cleaning on the leds depends on factors such as ultrasonic power and the assembl ed condition. ultrasonic cleaning shall be pre-qualified to ensure this will not cause damage to the led 5. heat management ? heat management of leds must be ta ken into consideration during the desig n stage of led application. the current should be de-rated appropriately by referring to the de-rating curve found in each product specification. ? the temperature surrounding the led in the application should be controlled. please refer to the data sheet de-rating curve. 6. esd (electrostatic discharge) ? the products are sensitive to static electricity or su rge voltage. esd can damage a die and its reliability. when handling the products, the following measur es against electrostatic discharge are strongly recommended: eliminating the charge grounded wrist strap, esd footwear, clothes, and floors grounded workstation equipment and tools esd table/shelf mat made of conductive materials ? proper grounding is required for all devices, equipment, and machinery used in product assembly. surge protection should be considered when designing of commercial products. ? if tools or equipment contain insulating materials such as glass or plastic, the following measures against electrostatic discharge are strongly recommended: dissipating static charge with conductive materials preventing charge generation with moisture neutralizing the charge with ionizers 7. directions for use ? the leds should be operated with forward bias. the driving circuit must be designed so that the leds are not subjected to forward or reverse voltage while it is off. if reverse voltag e is continuously applied to the leds, it may cause migration resulting in led damage. 8. other ? above specification may be changed without notice. everlight will re serve authority on material change for above specification. ? when using this product, please observe the absolute maximum ratings and the instructions for using outlined in these specification sheets. everlight assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instru ctions included in these specification sheets. ? these specification sheets include materials protected under copyright of everlight corporation. please don?t reproduce or cause anyone to repro duce them without everlight?s consent.
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